Exposure apparatus and device manufacturing method

ABSTRACT

Disclosed is an exposure apparatus having an element to be cooled and being configured to expose a substrate to patter radiation by using the element, the apparatus including a reservoir configured to house a liquid coolant therein, a first pump disposed between the reservoir and the element and configured to supply the coolant from the reservoir to the element, a heater disposed between the first pump and the element and configured to heat the coolant supplied from the first pump, a jacket configured to receive the coolant from the heater and to cool the element, a second pump disposed between the jacket and the reservoir and configured to supply the coolant from the jacket to the reservoir, and a cooler disposed between the second pump and the reservoir and configured to cool the coolant supplied from the second pump.

FIELD OF THE INVENTION AND RELATED ART

This invention relates to an exposure apparatus and a device manufacturing method usable in manufacture of semiconductor devices, for example.

FIG. 4 illustrates a general structure of an exposure apparatus to which the present invention is applicable.

Denoted in the drawing at 31 is a light source of the exposure apparatus used for manufacture of semiconductor devices, for example. With regard to the wavelength of the light source, it has been shortened more and more to meet further miniaturization in linewidth of exposure patters, i.e., from i-line to excimer laser and, in the latter, from KrF excimer laser to ArF excimer laser. Currently, in order to meet yet further miniaturization in linewidth, use of F2 laser or EUV (Extreme Ultraviolet) light has been attempted.

A light beam 31 a emitted from the light source 31 is directed through a light input 32 to an illumination optical system 33 by which any illuminance non-uniformness is removed and beam shaping is performed, whereby an illumination light beam 31 b is produced. The light beam 31 b is then projected on a reticle 34 which is an original of the exposure pattern. The reticle 34 is placed on a reticle stage 35.

The light beam passes through the reticle 34 as a light beam 31 c which is subsequently projected through a projection optical system 36 onto a wafer 37 in a reduced scale. The wafer 37 is disposed at a plane which is optically conjugate with the reticle 34.

The wafer 37 is placed on a wafer stage 38 which is driven by linear motors, such that repeated exposures based on the step-and-repeat method are carried out.

In recent years, in an attempt to meet further miniaturization in linewidth of integrated circuits, there have been developed semiconductor exposure apparatuses of the type that the reticle stage 35 as well is driven by linear motors such that both the wafer stage 38 and the reticle stage 35 are moved in synchronism with each other. In this type of exposure apparatuses, the exposure area is narrowed into a slit-like shape and the wafer is exposed while both the reticle and the wafer are being scanningly moved.

Here, generally, the linear motor which is used as a drive source for the reticle stage 35 has a large amount of heat generation. In consideration of this, usually, it is cooled by cooling means having a jacket through which a liquid cooling medium (coolant) is circulated.

There is another problem. The projection optical system 36 and the reticle 34 through which the exposure light passes absorb a portion of the energy of exposure light 31 b or 31 c, and accumulation of heat resulting from this energy absorption has a non-negligible adverse influence to the imaging performance. Therefore, a fluid-circulation type cooling structure is used in association with the projection optical system 36 and the reticle 34.

FIG. 5 illustrates a conventional fluid cooling-medium circulation system in which a heat accumulating (reserving) member or a heat exhausting member is cooled by means of a liquid cooling medium (coolant) and the cooling medium is circulated to cool the components housed inside an exposure apparatus.

As shown in FIG. 5, for heat exhaustion and temperature adjustment, a jacket 13 formed in the heat exhausting member 11 is connected to a circulating device 12 through an upstream pipe 14 a and a downstream pipe 14 b, respectively, whereby a liquid cooling-medium circulation system for the cooling medium 15 is provided. Here, the circulating device 12 comprises a cooling device 19 for exhausting the heat from the cooling medium 15 which has absorbed heat discharged from the heat exhausting member 11, a reservoir 16 for reserving the cooling medium 15 supplied from the cooling device 19, a supply pump 17 for drawing the cooling medium 15 from the reservoir and supplying it, a heating device 18 for heating the cooling medium 15 supplied from the supply pump 17, a temperature sensor 20 for detecting the temperature 20 a at the downstream pipe 14 b connected to the jacket 13, and a temperature controller 21 for controlling the heating temperature at the heating device 18 so as to maintain the temperature 20 a at a predetermined level.

The cooling medium 15 inside the reservoir 16 is forwarded by the supply pump 17 to the heating device 18 and, after being heated and temperature-controlled, it is supplied into the heat exhausting member 11.

In order to maintain the temperature 20 a of the cooling medium 15 to be detected by the temperature sensor 20, at a constant level, PID feedback control through the temperature controller 21 is carried out. Thus, by controlling the output of the heating device 18, the heating and temperature-adjustment is performed.

The thus temperature-controlled cooling medium 15 goes through the heat exhausting member 11 and the jacket 13 formed in the heat exhausting member 11, whereby heat exchanging is carried out. By this, the temperature of the heat exhausting member 11 is stabilized about the temperature of the cooling medium 15, and the heat exhausting of the heat exhausting member 11 is accomplished.

The cooling medium 15 having absorbed the heat from the heat exhausting member 11 is forwarded to the cooling device 19, whereby the heat is discharged outwardly of the circulating device 12 (circulation system). After that, the cooling medium 15 returns to the reservoir 16.

In the liquid cooling-medium circulation system of this example, the heat exhausting and temperature adjustment of the heat exhausting member 11 is carried out with the structure as described above.

Furthermore, Japanese Laid-Open Patent Application, Publication No. 2002-206833 proposes a method of reducing vibration of a structure housed in a container, in a cooling system for cooling that structure by use of a liquid cooling medium introduced into the container.

On the other hand, in order to meet required increases of the throughput in recent exposure apparatuses, the amount of heat generation by the linear motor is increasing. The heat generation of the linear motor will cause temperature fluctuation inside the exposure apparatus, resulting in degradation of the measurement precision of laser interferometers or, alternatively, measurement errors due to thermal expansion.

In order to reduce the thermal influence, the flow rate of the cooling medium should be increased. However, the increase of the cooling-medium flow rate will lead to increased pressure applied to the jacket 13. Since the pressure increase is proportional to the square of the flow rate increase, the increase of flow rate is limited by the withstand pressure of the jacket 13.

If the withstand pressure of the jacket 13 can not be enlarged due to any structural reason, the system has to be operated with a restricted flow rate of the cooling medium and yet without causing thermal influence. Hence, the own speed performance of the stage itself couldn't be used, and the throughput would necessarily be decreased.

As a convenient solution for reducing the pressure, a liquid forwarding supply pump 17 may be disposed downstream of the heat exhausting member 11 which is a heat source.

In this case, the disposition of the circulation system components is in an order of reservoir 16, heat exchanging member 11 and supply pump 17. Thus, the reservoir 16 is at an atmospheric pressure and the suction port of the supply pump 17 is at a negative pressure corresponding to the pressure loss.

However, there is a limitation due to the vapor pressure of the cooling medium 15 and the required NPSH (Required Net Positive Suction Head) of the pump 16. Therefore, if the system has a large loss, it is still impossible to provide a large flow rate.

SUMMARY OF THE INVENTION

It is accordingly an object of the present invention a unique technique by which the pressure increase in a jacket can be reduced and yet the flow rate of a cooling medium can be enlarged.

In accordance with an aspect of the present invention, to achieve this object, there is provided an exposure apparatus having an element to be cooled and being configured to expose a substrate to patter radiation by using the element, said apparatus comprising: a reservoir configured to house a liquid coolant therein; a first pump disposed between said reservoir and the element and configured to supply the coolant from said reservoir to the element; a heater disposed between said first pump and the element and configured to heat the coolant supplied from said first pump; a jacket configured to receive the coolant from said heater and to cool the element; a second pump disposed between said jacket and said reservoir and configured to supply the coolant from said jacket to said reservoir; and a cooler disposed between said second pump and said reservoir and configured to cool the coolant supplied from said second pump.

In accordance with another aspect of the present invention, there is provided a method of manufacturing a device, said method comprising steps of: exposing a substrate to light using an exposure apparatus as recited above; developing the exposed substrate; and processing the developed substrate to manufacture the device.

These and other objects, features and advantages of the present invention will become more apparent upon a consideration of the following description of the preferred embodiments of the present invention taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view showing a general structure according to a first embodiment of the present invention.

FIG. 2 is a schematic view showing a general structure according to a second embodiment of the present invention.

FIG. 3 is a schematic view showing a general structure according to a third embodiment of the present invention.

FIG. 4 is a schematic view of an exposure apparatus to which an embodiment of the present invention is applied.

FIG. 5 is a schematic view showing a general structure of a conventional liquid cooling-medium circulation system.

FIG. 6 is a flow chart for explaining microdevice manufacturing processes.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will now be described with reference to the attached drawings.

[Embodiment 1]

Referring to FIG. 1, a liquid cooling medium circulation system for an exposure apparatus, according to a first embodiment of the present invention, will be described.

The reference numerals in FIG. 1 similar to those referred to in the conventional structure shown in FIG. 5 are assigned to corresponding elements. In this embodiment, a plurality of heat exhausting members 11 are used.

Generally, the liquid cooling medium circulation system of the exposure apparatus according to the first embodiment is arranged to cool, by means of a liquid-like cooling medium (coolant), the heat exhausting member which exhausts heat to cool the components housed inside an exposure apparatus such as shown in FIG. 4.

A reservoir 16 is a container which is filled with a cooling medium (coolant) 15. A supply pump 17 is a device which is provided at the upstream side of the heat exhausting members 11, for supplying the cooling medium 15 from the reservoir 16.

A heating device 18 is a heater for heating the cooling medium 15 supplied thereto from the supply pump 17. A temperature controller 21 is a device for controlling the heating temperature at the heater 18 so as to maintain the temperature of the cooling medium 15 at a predetermined temperature.

Jackets 13 are formed in the heat exhausting members 11, and the cooling medium 15 is supplied thereto from the heater 18. A pressure reducing pump 1 is provided at the downstream side of the heat exhausting members 11. It is communicated with each jacket 13 to reduce the pressure inside the jacket 13.

A cooling device 19 is a device for exhausting heat out of the cooling medium 15 as supplied from the pressure reducing pump 1. The circulation system 12 includes the components described above.

The cooling medium 15 is temperature adjusted in a similar manner as has been described with reference to the conventional coolant circulation system shown in FIG. 5.

The pressure at the suction port of the pressure reducing pump 1 corresponds to the remainder that remains when the head ΔPh of the pressure reducing pump 1 is subtracted from the pressure loss ΔPr from the pressure reducing pump 1 to the reservoir 16. Thus, a negative pressure is reduced if the head generated by the pressure reducing pump 1 is larger than the pressure loss downstream of it. Furthermore, if the pressure reducing pump 1 is disposed at a position higher than the reservoir 16 and when the height (level) difference therebetween is denoted by h, the liquid cooling medium density is denoted by ρ and the gravitational acceleration is denoted by g, the pressure is reduced by an amount corresponding to “ρgh”.

However, in liquid medium pumping, there is a negative pressure limit (vacuum limit) depending on the vapor pressure of the liquid cooling medium at a used temperature thereof as well as the required NPSH of the pump itself. If the level is lower than the negative pressure limit value, cavitation occurs and the cooling medium pumping is no more attainable. Additionally, the components of the circulation system may be damages seriously.

In consideration of this and in order to avoid cavitation, a pressure sensor 2 is provided to detect the pressure at the suction port of the pressure reducing pump 1, where the pressure becomes lowest.

In addition to this, a pressure-reducing-pump suction pressure adjusting means that comprises a back pressure adjusting valve 3, disposed downstream of the pressure reducing pump 1, is newly provided. More specifically, the pressure loss at the downstream side of the pressure reducing pump 1 is adjusted by means of the back pressure adjusting valve 3 to avoid the suction pressure to go beyond the negative pressure limit.

Alternatively, a pressure control system (not shown) that controls the back pressure adjusting valve 3 while using the pressure sensor 2 as an input and the back pressure adjusting valve 3 as an output, may be provided to assure that the suction pressure of the pressure reducing pump 1 is maintained at a predetermined constant pressure.

The flow rate adjustment is carried out by using flow rate adjusting means that comprises a flow rate adjusting valve 4 and a flow rate sensor 5 which are disposed between the heat exhausting member 11 and the supply pump 17. By disposing the flow rate adjusting valve 4 at the upstream side of the heat exhausting member 11, a pressure rise corresponding to the pressure loss is prevented.

Where a plurality of heat exhausting members are used such as in the first embodiment, preferably each member should be provided with similar flow rate adjusting means.

Alternatively, a flow rate control system (not shown) that controls the flow rate adjusting valve 4 while using the flow rate sensor 5 as an input and the flow rate adjusting valve 4 as an output, may be provided to assure that the flow rate is maintained at a predetermined constant level.

In accordance with the first embodiment described above, the pressure to be applied to the heat exhausting member 11 can be reduced by an amount corresponding to the sum of the pressure loss downstream of the pressure reducing pump 1 and the negative pressure limit.

Furthermore, with the provision of the suction pressure adjusting means for the pressure reducing pump 1, any differences in height or in pipe pressure loss can be absorbed flexibly.

For enhanced pressure reduction effect, the pressure reducing pump 1 should preferably be disposed downstream of and yet quite close to the heat exhausting member as much as possible.

[Embodiment 2]

Next, referring to FIG. 2, a liquid cooling medium circulation system for an exposure apparatus, according to a second embodiment of the present invention, will be described.

Similar reference numerals are assigned to the components of this embodiment corresponding to those of the first embodiment shown in FIG. 1.

In this embodiment, the suction pressure adjusting means for the pressure reducing pump 1 comprises a pressure-reducing-pump revolution control system 6 that controls the revolution speed of the pressure reducing pump 1 while using the pressure sensor 2 as an input and the pressure reducing pump 1 as an output, to assure that the suction pressure of the pressure reducing pump 1 is maintained at a predetermined constant pressure.

Furthermore, the flow rate adjusting means comprises a supply pump revolution control system 7 that controls the revolution speed of the supply pump 17 while using the flow rate sensor 5 as an input and the supply pump 17 as an output, to assure that a predetermined constant flow rate is maintained.

A similar pressure reducing effect is attainable with this embodiment, like the first embodiment.

[Embodiment 3]

Next, referring to FIG. 3, a liquid cooling medium circulation system for an exposure apparatus, according to a third embodiment of the present invention, will be described.

Similar reference numerals are assigned to the components of this embodiment corresponding to those of the first and embodiments shown in FIGS. 1 and 2.

In this embodiment, there is a bypass pipe 8 that extends without passing through the flow rate adjusting valves 4 and the heat exhausting members 11.

In addition to this, a shut-off valve 9 is provided at the downstream side of a branching point 8 a of the bypass pipe 8 and at the upstream side of the heat exhausting member 11. Furthermore, another shut-off valve 9 is provided at the upstream side of the junction point 8 b of the bypass pipe 8 and at the downstream side of the heat exhausting member 11. Also, a bypass flow rate adjusting valve 10 is provided along the bypass pipe 8.

Where the flow rate adjustment is made manually by using the flow rate adjusting valve 4 and if the supply pump 17 is started before the adjustment is made, it is possible that the liquid medium flows at a flow rate more than a predetermined and the pressure goes beyond the withstand pressure. If the flow rate adjusting valve is restricted to prevent this, it leads to disadvantageous non-discharge operation of the supply pump 17.

In consideration of this, the bypass pipe 8 and the shut-off valve 9 are provided as a protecting means for the heat exhausting member 11. In operation, while keeping the shut-off valve 9 closed, the supply pump 17 is started with the bypass pipe 8, and a pseudo pressure loss of the heat exhausting member 11 is generated through the bypass flow rate adjusting valve 10 on the bypass pipe 8.

Furthermore, after the flow rate adjustment, the shut-off valve 9 is opened and the flow rate adjusting valve 4 is opened while the bypass flow rate adjusting valve is restricted. By this, any problems due to the pressure rise in the initial flow rate adjustment are avoided.

[Embodiment of Device Manufacturing Method]

Next, an embodiment of a device manufacturing method which uses an exposure apparatus described above, will be explained with reference to an example of semiconductor device manufacture.

FIG. 6 is a flow chart for explaining the overall procedure for semiconductor device manufacture. Step 1 is a design process for designing a circuit of a semiconductor device. Step 2 is a process for making a mask on the basis of the circuit pattern design.

On the other hand, Step 3 is a process for preparing a wafer by using a material such as silicon. Step 4 is a wafer process which is called a pre-process wherein, by using the thus prepared mask and wafer, a circuit is formed on the wafer in practice, in accordance with lithography. Step 5 subsequent to this is an assembling step which is called a post-process wherein the wafer having been processed at step 4 is formed into semiconductor chips. This step includes an assembling (dicing and bonding) process and a packaging (chip sealing) process. Step 6 is an inspection step wherein an operation check, a durability check an so on, for the semiconductor devices produced by step 5, are carried out. With these processes, semiconductor devices are produced, and finally they are shipped (step 7).

More specifically, the wafer process at step 4 described above includes: (i) an oxidation process for oxidizing the surface of a wafer; (ii) a CVD process for forming an insulating film on the wafer surface; (iii) an electrode forming process for forming electrodes upon the wafer by vapor deposition; (iv) an ion implanting process for implanting ions to the wafer; (v) a resist process for applying a resist (photosensitive material) to the wafer; (vi) an exposure process for exposing the resist-coated wafer to light or patterned radiation, through the circuit pattern of the mask, by using the exposure apparatus described above; (vii) a developing process for developing the exposed wafer; (viii) an etching process for removing portions other than the developed resist image; and (ix) a resist separation process for separating the resist material remaining on the wafer after being subjected to the etching process. By repeating these processes, circuit patterns are superposedly formed on the wafer.

As described hereinbefore, the liquid cooling medium circulation system according to the embodiments of the present invention explained above may comprise a supply pump disposed upstream of a heat exhausting member, for supplying a cooling medium thereto from a reservoir, and a pressure reducing pump provided downstream of the heat exhausting member and being communicated with a jacket, to reduce the pressure in the jacket. With this arrangement, even for a heat exhausting member having a low withstand pressure, the flow rate of the cooling medium can be enlarged without causing a pressure increase and, as a result of it, a thermal influence can be reduced. Hence, components housed inside the exposure apparatus, such as stages, for example, can be cooled while assuring a high throughput.

While the invention has been described with reference to the structures disclosed herein, it is not confined to the details set forth and this application is intended to cover such modifications or changes as may come within the purposes of the improvements or the scope of the following claims.

This application claims priority from Japanese Patent Application No. 308968/2005 filed Oct. 24, 2005, for which is hereby incorporated by reference. 

1. An exposure apparatus having an element to be cooled and being configured to expose a substrate to patter radiation by using the element, said apparatus comprising: a reservoir configured to house a liquid coolant therein; a first pump disposed between said reservoir and the element and configured to supply the coolant from said reservoir to the element; a heater disposed between said first pump and the element and configured to heat the coolant supplied from said first pump; a jacket configured to receive the coolant from said heater and to cool the element; a second pump disposed between said jacket and said reservoir and configured to supply the coolant from said jacket to said reservoir; and a cooler disposed between said second pump and said reservoir and configured to cool the coolant supplied from said second pump.
 2. An apparatus according to claim 1, further comprising a first valve disposed between said second pump and said cooler.
 3. An apparatus according to claim 1, further comprising a pressure sensor disposed between the element and said second pump and configured to detect a pressure of the coolant, wherein said first valve is adjusted on the basis of an output of said pressure sensor.
 4. An apparatus according to claim 1, further comprising a pressure sensor disposed between the element and said second pump and configured to detect a pressure of the coolant, wherein a revolution speed of said second pump is adjusted on the basis of an output of said pressure sensor.
 5. An apparatus according to claim 1, further comprising a flow rate sensor disposed between said first pump and the element and configured to detect a flow rate of the coolant, and a second valve disposed between said first pump and said flow rate sensor, wherein said second valve is adjusted on the basis of an output of said flow rate sensor.
 6. An apparatus according to claim 1, further comprising a flow rate sensor disposed between said first pump and the element and configured to detect a flow rate of the coolant, wherein a revolution speed of said first pump is adjusted on the basis of an output of said flow rate sensor.
 7. An apparatus according to claim 1, further comprising (i) a bypass flowpassage configured to bypass the element, said bypass flowpassage being configured to connect a branching point between said first pump and the element to a junction between the element and said second pump, (ii) a first shut-off valve provided between said branching point and the element, and (iii) a second shut-off valve provided between the element and said junction.
 8. An apparatus according to claim 7, further comprising a third valve disposed at said bypass flowpassage and configured to adjust the flow rate of the coolant through said bypass flowpassage.
 9. A method of manufacturing a device, said method comprising steps of: exposing a substrate to light using an exposure apparatus as defined in claim 1; developing the exposed substrate; and processing the developed substrate to manufacture the device. 